Polyimide
base material:

*Soldering of FPCs of this material is not recommended as it is not resistant to high temperature.

FPC Thickness:

*The FPC thickness does not include the thickness of stiffener and 3M tape.

Min track/spacing:

Min hole size/
Pad size(diameter):

Solder mask
(Coverlay):

Color of mask used to cover the PCB

Silkscreen:

Edge connector:

Stiffener:

Please make sure to note the area which need to stiffen in your file. e.g.
*Unusual parameters will result in a small price increase and longer lead time.

Normally, edge connector need be applied with PI stiffener.

Surface finish:

Thickness of
Immersion Gold:

Finished copper:

Inner Copper:

E-test:

3M/Tesa tape:

*Unusual parameters will result in a small price increase and longer lead time.

EMI shielding film:

Additional Options:

Impedance control  

*This option is only available for 1-layer or 2-layer boards with 0.5 oz Finished Copper.

Date code:

• None
• Add as PCBWay prefer
• Add as customer's required
• Update the designed date code

Other Special
request: