Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-41-169-17-101002

510-41-169-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,108 $31.22

RFQ

510-41-169-17-101002

Datasheet

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-13-000002

510-91-169-13-000002

SOCKET SOLDERTAIL 169-PGA

Mill-Max Manufacturing Corp.

3,130 $31.22

RFQ

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-17-101002

510-91-169-17-101002

SOCKET SOLDERTAIL 169-PGA

Mill-Max Manufacturing Corp.

2,327 $31.22

RFQ

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-272M20-001152

550-10-272M20-001152

BGA SOLDER TAIL

Preci-Dip

2,242 $30.08

RFQ

550-10-272M20-001152

Datasheet

Bulk 550 Active BGA 272 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
36-3570-11

36-3570-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,232 $31.41

RFQ

36-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3571-11

36-3571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,433 $31.41

RFQ

36-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3572-11

36-3572-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,468 $31.41

RFQ

36-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3573-11

36-3573-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,041 $31.41

RFQ

36-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3574-11

36-3574-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,801 $31.41

RFQ

36-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3575-11

36-3575-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,884 $31.41

RFQ

36-3575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6571-11

36-6571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,015 $31.41

RFQ

36-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6572-11

36-6572-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,423 $31.41

RFQ

36-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6573-11

36-6573-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,071 $31.41

RFQ

36-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6574-11

36-6574-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,086 $31.41

RFQ

36-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6575-11

36-6575-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,218 $31.41

RFQ

36-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-43-133-14-071001

510-43-133-14-071001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,833 $31.42

RFQ

510-43-133-14-071001

Datasheet

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-173-16-005001

510-91-173-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,509 $31.53

RFQ

510-91-173-16-005001

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-173-16-005002

510-91-173-16-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,046 $31.53

RFQ

510-91-173-16-005002

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-173-16-005003

510-91-173-16-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,702 $31.53

RFQ

510-91-173-16-005003

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-132-14-071002

510-93-132-14-071002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,372 $31.54

RFQ

510-93-132-14-071002

Datasheet

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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