Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-652-61-008000

116-93-652-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,777 $28.11

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-964-61-001000

110-13-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,604 $28.16

RFQ

Tube * Active - - - - - - - - - - - - - -
32-6570-11

32-6570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3,686 $28.20

RFQ

32-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3503-31

36-3503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,619 $28.85

RFQ

36-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-360M19-001166

550-10-360M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2,037 $27.73

RFQ

550-10-360M19-001166

Datasheet

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-352M26-001166

550-10-352M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2,327 $27.93

RFQ

550-10-352M26-001166

Datasheet

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-108-12-051002

510-93-108-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,523 $29.11

RFQ

510-93-108-12-051002

Datasheet

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-6551-11

36-6551-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,635 $26.25

RFQ

36-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-11

36-6552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,606 $26.25

RFQ

36-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-11

36-6553-11

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3,123 $26.25

RFQ

36-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3552-11

36-3552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,799 $26.25

RFQ

36-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-11

36-3554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,625 $26.25

RFQ

36-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-11

36-6554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,728 $26.25

RFQ

36-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-652-61-006000

116-43-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,764 $26.29

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-652-61-006000

116-93-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,638 $26.29

RFQ

Tube * Active - - - - - - - - - - - - - -
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip

3,895 $24.59

RFQ

517-83-411-20-111111

Datasheet

Bulk 517 Active PGA 411 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6556-21

32-6556-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,563 $26.35

RFQ

32-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
32-6556-31

32-6556-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,130 $26.35

RFQ

32-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
123-13-952-41-001000

123-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,962 $26.38

RFQ

123-13-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-0508-21

36-0508-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

2,419 $26.40

RFQ

36-0508-21

Datasheet

Bulk 508 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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