Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-072-09-001002

510-91-072-09-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,719 $23.86

RFQ

510-91-072-09-001002

Datasheet

Bulk 510 Active PGA 72 (9 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-09-001003

510-91-072-09-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,744 $23.86

RFQ

510-91-072-09-001003

Datasheet

Bulk 510 Active PGA 72 (9 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-042002

510-91-072-11-042002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,564 $23.86

RFQ

510-91-072-11-042002

Datasheet

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-042003

510-91-072-11-042003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,588 $23.86

RFQ

510-91-072-11-042003

Datasheet

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-061002

510-91-072-11-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,246 $23.86

RFQ

510-91-072-11-061002

Datasheet

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-061003

510-91-072-11-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,469 $23.86

RFQ

510-91-072-11-061003

Datasheet

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
416-93-264-41-001000

416-93-264-41-001000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.

3,606 $23.86

RFQ

416-93-264-41-001000

Datasheet

Tube 416 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - -
510-93-049-07-000002

510-93-049-07-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,622 $23.87

RFQ

510-93-049-07-000002

Datasheet

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-049-07-000003

510-93-049-07-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,290 $23.87

RFQ

510-93-049-07-000003

Datasheet

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-648-61-001000

111-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,588 $23.87

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-648-61-001000

111-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,067 $23.87

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-642-61-105000

110-43-642-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,572 $23.88

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-642-61-105000

110-93-642-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,658 $23.88

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-650-61-003000

115-43-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,575 $23.90

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-650-61-003000

115-93-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,902 $23.90

RFQ

Tube * Active - - - - - - - - - - - - - -
48-3570-10

48-3570-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,783 $23.92

RFQ

48-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3571-10

48-3571-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,208 $23.92

RFQ

48-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3572-10

48-3572-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,694 $23.92

RFQ

48-3572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3573-10

48-3573-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,843 $23.92

RFQ

48-3573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3575-10

48-3575-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,134 $23.92

RFQ

48-3575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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