Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-428-41-105000

110-91-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,758 $13.97

RFQ

110-91-428-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-628-41-105000

110-91-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,993 $13.97

RFQ

110-91-628-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-81000-310C

18-81000-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,693 $13.98

RFQ

18-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81250-310C

18-81250-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,484 $13.98

RFQ

18-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8250-310C

18-8250-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,340 $13.98

RFQ

18-8250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8300-310C

18-8300-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,249 $13.98

RFQ

18-8300-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8375-310C

18-8375-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,224 $13.98

RFQ

18-8375-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8400-310C

18-8400-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,374 $13.98

RFQ

18-8400-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8406-310C

18-8406-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,199 $13.98

RFQ

18-8406-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8465-310C

18-8465-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,872 $13.98

RFQ

18-8465-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8500-310C

18-8500-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,765 $13.98

RFQ

18-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8545-310C

18-8545-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,208 $13.98

RFQ

18-8545-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8600-310C

18-8600-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,743 $13.98

RFQ

18-8600-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8670-310C

18-8670-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,094 $13.98

RFQ

18-8670-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8750-310C

18-8750-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,241 $13.98

RFQ

18-8750-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
146-93-318-41-013000

146-93-318-41-013000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,921 $13.98

RFQ

146-93-318-41-013000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-318-41-013000

146-43-318-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,883 $13.98

RFQ

146-43-318-41-013000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-120-41-012000

346-93-120-41-012000

SOCKET SLDRLSS PRESSFIT SIP20POS

Mill-Max Manufacturing Corp.

3,652 $13.98

RFQ

346-93-120-41-012000

Datasheet

Tube 346 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-314-41-001000

612-41-314-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,611 $13.98

RFQ

612-41-314-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-314-41-001000

612-91-314-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,098 $13.98

RFQ

612-91-314-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 368369370371372373374375...1100Next»
payment
payway
HOME ICO

HOME

PRODUCT ICO

PRODUCT

PHONE ICO

PHONE

USER ICO

USER

Online IcoOnline