Flow sheet into a brick, engineer nightmare!

Chip flow is a very important step in semiconductor manufacturing, is the design of the chip pattern engraved on the silicon chip, so as to create a finished chip. However, in this process, there are often some problems, which may lead to chip failure or performance degradation, which will bring huge economic losses to the company.
For example, the existing PDK file version is inconsistent with the latest version of Foundry, and the naming method of foundry file is not understood. What should we do when we meet various problems in filling out Foundry Tape-out survey form, how to ensure the control of GDS file transmission and data confidentiality, and whether the company can provide the post-sealing test service of wafer flow, etc. Even if the chip is completed, it also needs to carry out a series of work such as test verification, reliability testing, package testing, debugging and optimization, documentation and report submission to ensure the correctness, stability and performance of the chip.
In order to avoid various problems that may occur after the chip flow as far as possible, small and medium-sized chip design enterprises can seek resources and experienced third-party chip flow service platforms to cooperate, solve supply chain problems together, and improve the success rate of one-time chip flow.
"Efficient platform mode, safe, reliable and efficient one-stop chip design, flow sheet, sealed test platform, one-stop to complete customer research and development needs; The professional technical team has achieved the goal of successfully lighting the chip in one design, which is very difficult; The low cost and high quality delivery capability can match the characteristics of universities with small funds and high requirements."
"For our design company to build a bridge to the fab with their semiconductor process expertise, as well as warm and efficient communication to enhance our research and development efficiency." More importantly, in the entire production capacity is very tight environment, for us to win valuable production resources, to ease our operating pressure. We look forward to closer cooperation in the future and greater growth of our business."
With the continuous progress and innovation of technology, the field of chip manufacturing will also usher in more challenges and opportunities. The elite will keep up with the pace of technological development, make full preparation and planning, and constantly improve the service capacity and level to adapt to the changing market demand and competitive environment.